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Apple Q3: iPhone up 13% YoY to $44.58B, vs. $40.22B est., Mac up 15% to $8.05B, iPad down 8% to $6.58B, and Wearables, Home, and Accessories down 9% to $7.4B (Apple)

Apple : Apple Q3: iPhone up 13% YoY to $44.58B, vs. $40.22B est., Mac up 15% to $8.05B, iPad down 8% to $6.58B, and Wearables, Home, and A...

1 February 2024

Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs (Financial Times)

Financial Times:
Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs  —  South Korean company's memory chips will be packaged with Nvidia processors to create more powerful AI products

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