26 May 2024

Japanese chipmaker Rapidus plans to build and package chips in the same $32B fab in Hokkaido, setting the company apart from TSMC, Intel, and Samsung (Anton Shilov/AnandTech)

Anton Shilov / AnandTech:
Japanese chipmaker Rapidus plans to build and package chips in the same $32B fab in Hokkaido, setting the company apart from TSMC, Intel, and Samsung  —  To say that the global foundry market is booming right now would be an understatement.  Demand for leading-edge process technologies driven …

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