Will's Blog: Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity (Bloomberg)

21 November 2023

Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity (Bloomberg)

Bloomberg:
Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity — The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industry. China is moving in on the same arena.

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