Samsung plans to invest ~$280M over five years in a chip packaging research facility in Yokohama, Japan and will receive up to ~$140M in government subsidies (Reuters)

Reuters:
Samsung plans to invest ~$280M over five years in a chip packaging research facility in Yokohama, Japan and will receive up to ~$140M in government subsidies  —  South Korea's Samsung Electronics (005930.KS) will invest around 40 billion yen ($280 million) over five years in a facility …

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