Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs (Financial Times)

Financial Times:
Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs  —  South Korean company's memory chips will be packaged with Nvidia processors to create more powerful AI products

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