Sources: SK Hynix plans to spend ~$4B to build an advanced chip packaging facility in West Lafayette, Indiana; a source says operations could begin in 2028 (Wall Street Journal)

Wall Street Journal:
Sources: SK Hynix plans to spend ~$4B to build an advanced chip packaging facility in West Lafayette, Indiana; a source says operations could begin in 2028  —  The South Korean memory chip maker is expected to build an advanced-packaging facility in West Lafayette, creating up to 1,000 jobs.

Posted from: this blog via Microsoft Power Automate.

Do your Amazon shopping through this link.