Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned ~$2B facility in Peoria, Arizona (Anton Shilov/Tom's Hardware)

Anton Shilov / Tom's Hardware:
Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned ~$2B facility in Peoria, Arizona  —  Apple and Nvidia rejoice.  —  When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria …

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