The US finalizes a $458M grant for SK Hynix under the CHIPS Act and $500M in loans to build a $3.87B chip packaging facility in Indiana (Mackenzie Hawkins/Bloomberg)

Mackenzie Hawkins / Bloomberg:
The US finalizes a $458M grant for SK Hynix under the CHIPS Act and $500M in loans to build a $3.87B chip packaging facility in Indiana  —  - Money will help build a plant and research facility in Indiana  — Initial agreement for Chips Act money was announced in August

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