Will's Blog: Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more (SemiAnalysis)

14 January 2026

Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more (SemiAnalysis)

SemiAnalysis:
Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more — IEDM 2025 Round-Up — It's an odd time in the chipmaking industry. On one hand, we are ramping into the biggest supercycle ever seen.

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