A look at advanced chip packaging, now more reliant on TSMC and its partners in Taiwan than ever, and the efforts to address this bottleneck in the US (Don Clark/New York Times)

Don Clark / New York Times:
A look at advanced chip packaging, now more reliant on TSMC and its partners in Taiwan than ever, and the efforts to address this bottleneck in the US  —  A silicon wafer reflecting Subramanian Iyer, a specialist at the University of California, Los Angeles, in a technology called advanced chip packaging.

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